Two-Component Addition-Cure Potting Compound (2.78 ± 0.05 g/cm3)
Catalog NO.: AIMRSE-FOA-044 Category: Electronic Encapsulants
Two-Component Addition-Cure Potting Compound is designed for thermal protection and encapsulation of power modules and other electronic components. It delivers reliable environmental and thermal insulation performance once fully cured.
| Density | 2.78 ± 0.05 g/cm3 |
| Appearance | A: Grey B: White |
| Viscosity | A: 7000-9000 cP B: 7000-9000 cP |
| Dielectric Constant | ≥ 15 kV/mm |
| Thermal Conductivity | ≥ 1.8 W/(m·k) |
| Hardness | 50-60 |
| Curing Time | 4-6 h |
| Volume Resistivity | ≥ 10 13 Ω·cm |
| Mix Ratio By Weight | 1:1 |
◈ No low-molecular volatile matter; cures without any by-products.
◈ Excellent electrical properties, featuring high impedance and high dielectric strength.
◈ Versatile curing options: cures at room temperature or accelerated by heat (the higher the temperature, the faster the cure).
Thermal encapsulation and protection for power modules.
Potting and thermal management for other electronic components.
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