Two-Component Condensation-Cure Potting Compound (1.42 ± 0.03 g/cm3)
Catalog NO.: AIMRSE-FOA-047 Category: Electronic Encapsulants
Two-Component Condensation-Cure Potting Compound is specifically designed for the encapsulation and protection of precision electronic components, rigid LED light bars, backlight modules, and solar cells.
| Density | 1.42 ± 0.03 g/cm3 |
| Appearance | A: White/BlacK B: Colorless and transparent |
| Viscosity | 800-1800 cP |
| Dielectric Constant | ≥ 20 kV/mm |
| Hardness | 35-45 |
| Curing Time | 0.5-1.5 h |
| Volume Resistivity | ≥ 10 15 Ω·cm |
| Mix Ratio By Weight | 6:1 |
◈ Provides a certain level of adhesion to substrates after curing.
◈ Low viscosity and low hardness.
◈ Non-corrosive to copper, PC, ABS, and other materials.
◈ Maintains stable performance over a long-term temperature range of −40°C to 200°C.
Specially used for the encapsulation and protection of precision electronic components, rigid LED light bars, backlight modules, and solar cells.
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