Ultra-High Vacuum Electron Beam Evaporation Coating System

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Ultra-High Vacuum Electron Beam Evaporation Coating System

Catalog NO.: AIMRSE-NRDE-008 Category: Nanotechnology R&D Equip

Ultra-High Vacuum Electron Beam Evaporation Coating System is an ultra-high vacuum evaporation system designed for depositing high-quality thin films. It features precise rate and thickness control, broad substrate temperature range, and includes a load lock for automatic sample delivery, suitable for R&D and pilot production.

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Ultra-High Vacuum Environment: Ensures highest quality film deposition for sensitive materials.
Broad Temperature Control: Substrates can be heated to high temperatures or cooled to low temperatures.
High Precision: High-precision control of deposition rate and film thickness ensures excellent uniformity and repeatability.
Load Lock Standard: Includes load lock for fully automatic sample delivery.
Optional Modules: Ion beam cleaning/assisted deposition and RF plasma cleaning.
Automation: PLC + PC fully automatic control.

Capable of depositing metals, semiconductors, and dielectric materials.
Suitable for depositing single-layer or multi-layer thin films.
Suitable for R&D and pilot production.

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