Two-Component Thermal Gel (1 - 12 W/m·K)
Catalog NO.: TIMTGS-0038 Category: Thermal Gel
This is a two-component thermal gel designed for automated dispensing applications. It provides excellent thermal conductivity and gap-filling capabilities, curing into a soft, compliant material that minimizes stress on components.
| Thermal Conductivity | 1.0 - 12.0 W/m·K |
| Volume Resistivity | 1011 Ω·cm |
| Density | 1.5 ~ 3.5 g/cm3 |
| Hardness | 20 ~ 70 Shore A |
| Breakdown Voltage | ≥ 5 kV/mm |
| Operating Temperature | - 40 - 200°C |
| Curing Time | 1 ~ 8 h at 25°C |
◈ Two-Component Room/Heat Cure: Cures at room temperature or with heat for flexible processing.
◈ High Thermal Conductivity: Provides efficient heat transfer for demanding applications.
◈ Excellent Gap Filling: Effectively fills irregular and uneven interfaces for optimal thermal contact.
◈ Low Assembly Stress: Soft, compliant nature reduces mechanical stress on components.
◈ Automation Friendly: Suitable for automated dispensing in high-volume manufacturing.
◈ Flame Retardant: Meets UL 94 V-0 flammability standards.
New Energy Vehicles: Thermal management for battery packs and power electronics.
Communication Base Stations: Cooling for 5G equipment and optical modules.
Industrial Automation: Heat dissipation for controllers and power supplies.
Power and Energy: Thermal interface for inverters and converters.
Consumer Electronics: Thermal management for high-performance devices.
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