BERGQUIST® LIQUI FORM TLF 10000

BERGQUIST® LIQUI FORM TLF 10000

Brand: AIMRSE

Catalog Number

ATG-C10-008

Category

Gap Fillers

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Description

Product Overview:	BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements of datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, this high thermal conductivity gel has won several industry awards. Dispensable pre-cured: requires no mixing or refrigeration Excellent thermal cycling performance and dispense properties Thermal conductivity: 10 W/m-K, ASTM D5470 Low thermal impedance at thin and thick gaps Low compression set to reduce stress on components
Features and Benefits:	High-performance thermal interface gel for telecom market applications
Capabilities:	Product category: Thermal gels Technologies: Thermal management, ultra high viscosity liquids Flame rating: V-0 Operating temperature: -60.0 °C - 200.0 °C Shelf life, @ 0.0 °C: 180.0 day Thermal conductivity: 10.0 W/mK

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