Design & Customization Services
In high-performance electronics, "one size fits all" is rarely true. Standard off-the-shelf components often force engineers to compromise on form factor, thermal efficiency, or EMI performance. Our Design & Customization Services remove these constraints. We act as your specialized engineering partner, capable of modifying internal power module topologies, optimizing PCB layouts for EMC compliance, and providing turnkey reference designs. We bridge the gap between raw semiconductor technology and your specific application requirements, ensuring your product is optimized for both performance and manufacturability.
Our Customization Capabilities
Custom Power Module Design
Challenges: Fixed pinouts, thermal limitations, parasitic inductance in standard packages.
Our Capabilities:
- Custom topology design (SiC/IGBT/GaN)
- Baseplate material selection (Cu, AlSiC)
- Low-inductance packaging optimization
- Pinout customization for spatial constraints
- Thermal simulation (CFD) validation
PCB Layout & EMI Consultation
Challenges: Radiated emissions failure, signal crosstalk, complex grounding schemes.
Our Capabilities:
- Pre-compliance EMC design review
- Shielding and filter placement strategy
- Parasitic extraction and analysis
- High-speed signal integrity optimization
- Ground loop elimination consulting
Reference Designs & EVBs
Challenges: Slow time-to-market, high R&D costs, schematic errors.
Our Capabilities:
- Turnkey reference schematics and BOMs
- Pre-validated Evaluation Boards (EVBs)
- Motor control and power conversion libraries
- Rapid prototyping support
- Driver code and software integration
Fig 1: From virtual validation to physical reality: We use advanced simulation to verify custom topologies before tooling begins.
Why Customization Matters
Standard components are cost-effective, but they often become the bottleneck in high-performance applications. We solve these critical engineering limitations.
Form Factor Constraints
Modern devices like drones and wearables have zero wasted space. Standard module shapes often don't fit. We redesign the packaging to maximize power density within your specific mechanical envelope.
Regulatory Compliance
New wide-bandgap materials (SiC/GaN) switch faster, creating more EMI noise. Without expert layout consultation, designs frequently fail EMC tests, causing expensive re-spins and launch delays.
Time-to-Market Pressure
Designing complex power stages from scratch takes months. Our Turnkey Reference Designs allow you to skip the schematic design phase and move straight to prototyping, saving critical R&D time.
Custom Design Workflow
Objective: Define clear technical targets and commercial boundaries.
Services:
- NRE & Scope Assessment: We evaluate your requirements (Voltage, Current, Rth, Size) and provide a Non-Recurring Engineering (NRE) quote and timeline.
- Technological Selection: Decide between Si, SiC, or GaN technologies and select the appropriate packaging material (e.g., molding compound, substrate).
Objective: Validate the design virtually to reduce physical iterations.
Services:
- 3D Modeling & Layout: Create the mechanical CAD model and internal circuit layout.
- Multi-Physics Simulation: Perform thermal (CFD) and electrical (Parasitic Inductance) simulations to predict performance and identify hotspots.
Objective: Deliver physical prototypes for customer evaluation.
Services:
- Rapid Prototyping: Manufacture "A-Sample" or "B-Sample" prototypes using our pilot line.
- Initial Function Test: Verify basic connectivity and static electrical parameters before shipment.
Objective: Rigorous testing to ensure reliability standards are met.
Services:
- Reliability Qualification: Conduct high-stress tests like Power Cycling, Temperature Cycling, and HTRB (High-Temperature Reverse Bias).
- System Integration Support: Assist your team in integrating the custom module or design into your final system.
Objective: Scale up to volume manufacturing with consistent quality.
Services:
- Process Locking: Finalize the manufacturing process control plan (PCP).
- Supply Chain Setup: Establish buffer stock and JIT delivery schedules to support your production ramp-up.
Custom Design Services FAQ
What specific technologies do you support for Custom Power Modules?
How can you assist if my PCB design is failing EMI compliance?
Do you offer turnkey solutions to speed up R&D?
What is the typical workflow for a custom design project?
1. Feasibility: NRE assessment and tech selection.
2. Simulation: 3D modeling and multi-physics (CFD/Electrical) validation.
3. Samples: Manufacturing "A-Sample" or "B-Sample" prototypes.
4. Verification: Reliability qualification (e.g., Power Cycling, HTRB).
5. Mass Production: Process locking and supply chain setup.
Are these design services suitable for clinical medical devices?
Need a Solution That Fits Perfectly?
Whether you need to shrink a power module for a drone or optimize a PCB for a medical device, our engineering team is ready to customize a solution for you. Stop compromising with standard parts.
For optimal application fit, we recommend reviewing latest specifications and validating within your design. Our team is available for technical consultation.
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