Power Module

Q: What is the primary advantage of using a Power Module versus Discrete Components?

While discrete components offer design flexibility for lower power, Power Modules are superior for high-power (>1kW) applications. They integrate multiple dies onto an isolated substrate, which significantly reduces parasitic inductance and thermal resistance. This leads to higher power density, simplified assembly (fewer parts), and higher system reliability due to matched components and pre-tested electrical characteristics.

Request a Quote

Redefining Power Density and Efficiency: In the modern landscape of electrification, the demand for compact, reliable, and efficient power conversion is higher than ever. AIMRSE Power Modules are engineered to bridge the critical gap between discrete components and full-system integration. By packaging high-performance switching devices—including Silicon IGBTs, Silicon Carbide (SiC), and Gallium Nitride (GaN)—with optimized gate drivers and protection logic, we deliver solutions that significantly reduce system size while enhancing performance.

Our power modules serve as the heartbeat of mission-critical systems, from the 800V traction inverters driving electric vehicles to the megawatt-scale power conversion systems (PCS) in renewable energy storage. We focus on minimizing parasitic inductance and maximizing thermal conductivity, ensuring our modules operate reliably under the most demanding conditions.

Advanced Packaging & Process Technology

The performance of a power module is defined not just by the silicon inside, but by how it is packaged. AIMRSE employs cutting-edge manufacturing techniques to ensure superior reliability.

Exploded view of advanced power module structure showing DBC substrate, silver sintering technology, and low-inductance interconnects.

Substrate Innovation (DBC/AMB)

We utilize Direct Bonded Copper (DBC) and Active Metal Brazed (AMB) substrates using Aluminum Nitride (AlN) ceramics. This provides exceptional isolation voltage (>4kV) and thermal conductivity comparable to aluminum metal, ensuring heat is rapidly transferred away from the chips.

Sintering & Interconnects

To withstand high operating temperatures (Tvj_op up to 175°C), we employ Silver (Ag) Sintering technology instead of traditional soldering. Combined with Copper Clip bonding, this reduces thermal resistance by 30% and significantly extends power cycling capability.

Low-Inductance Design

Our modules feature optimized laminar busbar layouts that minimize stray inductance to below 10nH. This allows for faster switching speeds with minimal voltage overshoot, critical for unlocking the potential of SiC and GaN devices.

Topology & Product Portfolio

Our portfolio covers the complete power conversion spectrum. We don't just supply components; we provide integrated subsystems based on advanced circuit topologies.

Product Type	Advanced Topologies	Key Specifications	Target Applications
ACDC Converters	- Vienna Rectifier (3-Level) - Totem-Pole PFC (Bridgeless) - Active Front End (AFE)	- Efficiency: >98% - PF > 0.99 - THD < 3%	EV Charging Stations (DCFC), Server Power Supplies, Industrial Rectifiers
DC/DC Converters	- LLC Resonant Converter - Dual Active Bridge (DAB) - Phase-Shift Full Bridge (PSFB)	- Switching Freq: up to 1MHz - Isolation: 5kV Reinforced - Bidirectional Capability	Energy Storage Systems (ESS), On-Board Chargers (OBC), Telecom Bus Converters

Customization Workflow

We understand that off-the-shelf solutions don't fit every project. Our dedicated engineering team provides full-cycle customization services:

Step 1: Consultation: Define voltage/current, topology, and thermal constraints.
Step 2: Simulation: Thermal and electrical simulation using SPICE/PLECS models.
Step 3: Prototyping: Rapid delivery of engineering samples (A-Samples).
Step 4: Validation: Rigorous testing (HTRB, IOL, Temperature Cycling) in our labs.
Step 5: Mass Production: Automated assembly with 100% AOI and X-Ray inspection.

System-Level Ecosystem

A power module is only as good as its supporting components. To ensure optimal system performance, we provide a complete ecosystem:

Thermal Interface Materials (TIM): Pre-applied Phase Change Material (PCM) or high-performance gap fillers to eliminate air voids.
EMI Suppression: Absorber sheets and magnetic materials to mitigate high-frequency noise generated by fast switching.
Integrated Sensors: Current and temperature sensors embedded within the module for precise control.

Discuss Your Custom Requirements →

Target Markets & Applications

E-Mobility (EV/HEV)

Supporting the transition to 800V architectures. Our modules are critical for main traction inverters, ensuring high torque density. Bidirectional DC/DC modules enable Vehicle-to-Grid (V2G) capabilities in On-Board Chargers (OBC).

Renewable Energy & Grid

Maximizing energy harvest in Solar PV Central Inverters and Wind Converters. Our high-voltage modules support 1500V DC links, while our AFE technology enables stable grid interconnection and energy storage integration.

Industrial Automation

Driving productivity with robust power for Servo Drives, Robotics, and UPS systems. Designed to withstand harsh industrial environments, offering high surge current capability and long-term reliability.

Technical FAQ

What is the primary advantage of using a Power Module versus Discrete Components?

While discrete components offer design flexibility for lower power, Power Modules are superior for high-power (>1kW) applications. They integrate multiple dies onto an isolated substrate, which significantly reduces parasitic inductance and thermal resistance. This leads to higher power density, simplified assembly (fewer parts), and higher system reliability due to matched components and pre-tested electrical characteristics.

How do you manage thermal dissipation in high-density modules?

Thermal management is multi-layered. Inside the module, we use high-conductivity ceramics (AlN) and silver sintering to move heat rapidly from the chip to the baseplate. Externally, we recommend high-performance Thermal Interface Materials (TIMs) like Phase Change Materials to eliminate air gaps between the module and heatsink. For extreme densities, we support Pin-Fin baseplates compatible with direct liquid cooling systems.

What is the typical lifespan and reliability testing standard for your modules?

Our industrial and automotive modules are designed for operational lifespans exceeding 15-20 years. We rigorously test according to AEC-Q101 and IEC 60747 standards. Key reliability tests include High Temperature Reverse Bias (HTRB), High Humidity High Temperature Reverse Bias (H3TRB) for moisture resistance, and Power Cycling (IOL) to ensure the integrity of wire bonds and solder joints over millions of thermal cycles.

Can you customize a power module for specific form factors or topologies?

Yes, customization is a core part of our service. We can modify existing standard packages (like 62mm, EconoDUAL, or EasyPACK styles) with different chip configurations (SiC vs IGBT), voltage ratings, or internal topologies (e.g., T-Type, NPC). We also offer full custom package development for customers with specific geometric constraints or unique thermal interface requirements.

Why should I consider SiC modules over traditional Silicon IGBT modules?

Silicon Carbide (SiC) modules are essential for applications prioritizing efficiency and size. SiC allows for much higher switching frequencies (>50kHz vs < 20kHz for IGBTs), which drastically reduces the size of passive components like inductors and capacitors. Additionally, SiC has almost zero reverse recovery charge, reducing switching losses by up to 70%, making it ideal for EV traction inverters and high-efficiency grid-tied inverters.

Engineered for Efficiency, Built for Reliability

Power conversion is the backbone of modern technology. Whether you need a standard ACDC front-end or a custom automotive traction module, AIMRSE delivers the technical expertise and manufacturing quality to power your innovation.

Explore ACDC Solutions Explore DC/DC Solutions

For optimal application fit, we recommend reviewing latest specifications and validating within your design. Our team is available for technical consultation.

Contact Form