BERGQUIST® LIQUI FORM TLF 4500CGEL-SF

BERGQUIST® LIQUI FORM TLF 4500CGEL-SF

Brand: AIMRSE

Catalog Number
ATG-C10-005
Category
Gap Fillers
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Description
Product Overview: BERGQUIST® LIQUI FORM TLF 4500CGEL-SF provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies. It’s capable of filling unique and intricate air voids and gaps, and is perfect for applications requiring highly reliable vertical gap stability. The silicone-free technology passes hazing and fogging tests, making it optimized for optical systems.

1-part cure-in-place (CIP) formulation
Optimized formulation to pass hazing and fogging tests
High thermal conductivity: 4.5 W/mK
High temperature stability
Robust and fast dispensing
Features and Benefits: High performance, silicone-free post-cure gel for automotive electronics
Capabilities: Product category:
Thermal gels
Technologies:

Thermal management, speciality liquids

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