BERGQUIST® LIQUI FORM TLF 6000HG

BERGQUIST® LIQUI FORM TLF 6000HG

Brand: AIMRSE

Catalog Number
ATG-C10-003
Category
Gap Fillers
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Description
Product Overview: BERGQUIST® LIQUI FORM TLF 6000HG is an award-winning, thermally conductive, dispensable, highly conformable thermal interface gel that provides electronic component thermal management capability within remote antennas and 5G base stations. It is ideal for filling larger gaps that measure up to 3.0 mm (0.11"), delivering robust vertical gap stability.

Dispensable pre-cured: requires no mixing or refrigeration
Thermal conductivity: 6.0 W/m-K
Stable viscosity in storage and in the application
Excellent chemical stability and mechanical stability
Low compression set to reduce stress on components
Features and Benefits: For telecom market applications requiring high gap fill
Capabilities: Product category:
Thermal gels
Technologies:

Thermal management, ultra high viscosity liquids

Flame rating:
V-0
Operating temperature:
-60.0 °C - 200.0 °C
Shelf life, @ 25.0 :
365.0 day
Thermal conductivity:
6.0 W/mK

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