Buffering Thermal Silicone Pad 1.0–5.0mm 1.3 W/mK (Extra Soft)
Brand: AIMRSE
Catalog Number
AIMRSE-ECM-TIM-19
Category
Thermal Interface Materials (TIM)
X
Description
Material with very low modulus to minimize stress on brittle components while maintaining adequate thermal path.
| Thickness (mm): | 1.0 / 1.5 / 2.0 / 3.0 / 4.0 / 5.0 |
| Thermal Conductivity (W/mK): | 1.3 |
| Density (g/cm³): | 1.7 |
| Hardness (Shore 00): | 8–18 |
| Color: | White |
| Operating Temperature (°C): | -50 to +200 |
| Silicone-Free: | No |
| Electrical Insulation (kV/mm): | ≥5 |
| Tensile Strength (MPa): | ≥0.4 |
| Elongation at Break (%): | ≥180 |
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