High-Density Gap Filler Pad (6 W/mK)

Brand: AIMRSE

Catalog Number
ATG-C8-013
Category
Gap Fillers
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Description
Product Overview: Tflex HD80000 combines 6.0 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress on components while also yielding low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
The Tflex HD80000 material is extremely soft, but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.
Features and Benefits: Low pressure versus deflection
Excellent surface wetting for low contact resistance
No fiberglass reinforcement
Minimizes board and component stress
Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Industries: Aerospace/Defense
Automotive
Consumer
Industrial
Telecom/Datacom
Applications: Automotive ADAS
Automotive Electronics
Automotive Infotainment
Automotive Powertrain/ECUs
Drones/Satellites
Gaming Systems
Instrumentation
Notebooks/Tablets/Portable Devices
Routers
Smart Home Devices
Wireless infrastructure
Capabilities: Automated Packaging
Automated Pad Placement
Custom Automation
Custom Product Development
Modeling
Prototyping
Service
Testing
Typical Properties Color: Teal
Typical Properties Density (g/cc): 3.3
Typical Properties Operating Temperature Max (Celsius): 150
Typical Properties Operating Temperature Min (Celsius): -65
Typical Properties Outgassing CVCM (%): 0.04
Typical Properties Outgassing TML (%): 0.3
Typical Properties Shelf Life: 2 years from Date of Shipment
Thermal Properties Thermal Conductivity (W/mK): 6
Electrical Properties Volume Resistivity: 1.10 x10^14 Ohm-cm
Compliance REACH: Yes
Compliance ROHS Compliant: Yes
Compliance UL Flammability Rating: V-0
Electrical Properties Dielectric Constant: 9
Mechanical Properties Hardness (Shore 00): 40
Dimensions Thickness Max (inches): 0.2
Dimensions Thickness Min (inches): 0.04
Thermal Properties Thermal Resistance @10 psi Max (C-in2/W): 0.768
Thermal Properties Thermal Resistance @10 psi Min (C-in2/W): 0.251
Thermal Properties Thermal Resistance @30 psi Max (C-in2/W): 0.125
Thermal Properties Thermal Resistance @30 psi Min (C-in2/W): 0.106
Thermal Properties Thermal Resistance @50 psi Max (C-in2/W): 0.103
Thermal Properties Thermal Resistance @50 psi Min (C-in2/W): 0.097
Dimensions Thickness Max (Microns): 5000
Dimensions Thickness Min (Microns): 1000

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