High-Density Gap Filler Pad (7.5 W/mK)
Brand: AIMRSE
Catalog Number
ATG-C8-015
Category
Gap Fillers
X
Description
| Product Overview: | Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material will provide minimal stress on components during application while maintaining low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device. · 7.5 W/mK thermal conductivity soft pad · Low pressure versus deflection · Minimizes board and component stress · Low outgassing and oil bleeding |
| Capabilities: | Automated Packaging Automated Pad Placement Custom Automation Custom Product Development Modeling Prototyping Service Testing |
| Typical Properties Color: | Grey |
| Typical Properties Density (g/cc): | 3.4 |
| Typical Properties Operating Temperature Max (Celsius): | 125 |
| Typical Properties Operating Temperature Min (Celsius): | -50 |
| Thermal Properties Thermal Conductivity (W/mK): | 7.5 |
| Electrical Properties Volume Resistivity: | 1.1X10^14 |
| Compliance Lead Free: | Yes |
| Compliance REACH: | Yes |
| Compliance ROHS Compliant: | Yes |
| Typical Properties Minimum Bondline Thickness (microns): | 1000 |
| Typical Properties Minimum Bondline Thickness (mm): | 1 |
| Electrical Properties Dielectric Breakdown Voltage (Volts AC): | 6.9 |
| Mechanical Properties Hardness (Shore 00): | 15 |
| Dimensions Thickness Max (inches): | 0.2 |
| Dimensions Thickness Max (mm): | 5 |
| Dimensions Thickness Min (inches): | 0.04 |
| Dimensions Thickness Min (mm): | 1 |
| Thermal Properties Thermal Resistance @10 psi Max (C-in2/W): | 0.133 |
| Thermal Properties Thermal Resistance @10 psi Min (C-in2/W): | 0.119 |
| Thermal Properties Thermal Resistance @30 psi Max (C-in2/W): | 0.087 |
| Thermal Properties Thermal Resistance @30 psi Min (C-in2/W): | 0.081 |
| Thermal Properties Thermal Resistance @50 psi Max (C-in2/W): | 0.083 |
| Thermal Properties Thermal Resistance @50 psi Min (C-in2/W): | 0.077 |
| Dimensions Thickness Max (Microns): | 5000 |
| Dimensions Thickness Min (Microns): | 1000 |
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