High Thermal Diffusivity Polypropylene Sheet
Brand: AIMRSE
Catalog Number
ATG-C1-001
Category
Tlam Thermally Conductive PCB System
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Description
| Product Overview: | Tlam™ is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications. The heart of this system is the thermally conductive pre-preg, Tlam™ PP HTD. This ceramically filled 2.2 W/mK, dielectric prepreg offers 8 times better thermal performance over FR4, while maintaining good adhesion and voltage breakdown properties. Tlam™ PP HTD is a “B” State epoxy film providing room temperature stability for 6 months. Tlam™ PP HTD is provided in multiple thicknesses. Thinner films offer better thermal performance while thicker films offer better dielectric strength. Tlam™ PP HTD can be used to build many different combinations of PCB laminates. The simplest is copper foil, Tlam™ PP HTD dielectric and an aluminum base plate which acts as a heatsink and adds rigidity. Board complexity goes up from here offering multi-layer boards constructions and PCB structures can further include varying layers of Tlam™ PP HTD and FR4 layers to give the thermal properties where need while maintaining cost effectiveness. Tlam™ PP HTD can laminated with copper foils from ½ oz to 4 oz can be used aluminum or copper base plates ranging from 2.5mm to 6mm thick. Further Tlam™ PP HTD and be laminated on both sides with copper films to make traditional type PCB Cores. · Low Thermal Resistance for SMD & Chip & Wire Components · Compatible with Heavy Copper Foil & most Pre-pregs · Low Modulus for Stress Relief & High Reliability · High Tg for Excellent HV & Hi-Temperature Operation (1HTD) · Mechanically Rugged under Vibration and Mechanical Shock · Integral aluminum Base Plate for Mechanical & Thermal Interface · Compatible with Power Substrate & Multilayer Construction · Uses Standard low-cost PCB Fabrication Techniques · Can run through standard pick and place SMT and manual wire bond processes. |
| Industries: | Aerospace/Defense Automotive and Industrial Electronics Electric Vehicle electrical power generators Industrial Electronics Switch mode power supplies Telecom/Datacom UPS unit |
| Applications: | Automotive Electronics Automotive Lighting Avionics Base station/Power amplifier/Acitve antenna unit /small cell DC-DC Converters Instrumentation/Test and measure LED Lighting Power Converters Power Supplies Satellites Wireless Communication Systems |
| Capabilities: | Automated Packaging Automated Pad Placement Custom Automation Custom Product Development Modeling Prototyping Testing |
| Thermal Properties Thermal Conductivity (W/mK): | 2.2 |
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