Soft High-Conductivity Gap Filler (7 W/mK)

Brand: AIMRSE

Catalog Number
ATG-C8-001
Category
Gap Fillers
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Description
Product Overview: Tflex SF7 is an innovative, high performing thermal material in Laird’s silicone free gap filler portfolio.  The silicone free technology provides products with excellent deflection properties, providing minimal pressure on components during deflection.   Very little pressure is required to reach the lowest possible thermal resistance.  Thickness ranges from 0.5mm (0.020″) to 4mm (0.160″) in 0.5mm (0.020″) increments available as standard.
Features and Benefits: Silicone free formulation
Low peak and residual pressure
Excellent surface wetting for low contact resistance
Exceptionally low thermal resistance
UL V0 Flammability Rating
Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Industries: Aerospace/Defense
Automotive
Consumer Electronics
Datacom
Industrial Electronics
Telecom
Applications: Automotive ADAS
Graphic Cards
Instrumentation
Optical Module
Routers
Servers
Capabilities: Automated Packaging
Automated Pad Placement
Custom Automation
Custom Product Development
Modeling
Prototyping
Service
Testing
Typical Properties Color: Grey
Typical Properties Density (g/cc): 3.4
Typical Properties Operating Temperature Max (Celsius): 125
Typical Properties Operating Temperature Min (Celsius): -65
Typical Properties Shelf Life: 2 years from Date of Shipment
Thermal Properties Thermal Conductivity (W/mK): 7
Electrical Properties Volume Resistivity: 5 x 10^13
Compliance Lead Free: Yes
Compliance REACH: Yes
Compliance ROHS Compliant: Yes
Compliance UL Flammability Rating: V-0
Electrical Properties Dielectric Breakdown Voltage (Volts AC): 7.9
Mechanical Properties Hardness (Shore 00): 40
Dimensions Thickness Max (inches): 0.16
Dimensions Thickness Max (mm): 4
Dimensions Thickness Min (inches): 0.02
Dimensions Thickness Min (mm): 0.5
Thermal Properties Thermal Resistance @10 psi Max (C-in2/W): 0.576
Thermal Properties Thermal Resistance @10 psi Min (C-in2/W): 0.055
Thermal Properties Thermal Resistance @30 psi Max (C-in2/W): 0.056
Thermal Properties Thermal Resistance @30 psi Min (C-in2/W): 0.051
Thermal Properties Thermal Resistance @50 psi Max (C-in2/W): 0.054
Thermal Properties Thermal Resistance @50 psi Min (C-in2/W): 0.049
Dimensions Thickness Max (Microns): 4000
Dimensions Thickness Min (Microns): 500

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