Soft Ultra-High-Conductivity Gap Filler (10.2 W/mK)

Brand: AIMRSE

Catalog Number
ATG-C8-007
Category
Gap Fillers
Request a Quote
X
Description
Product Overview: Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.
Features and Benefits: Silicone free formulation
Low Shore Hardness
Low pressure versus deflection
Minimizes board and component stress
No fiberglass reinforcement
Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Industries: Aerospace/Defense
Automotive
Consumer
Industrial
Telecom/Datacom
Applications: Automotive ADAS
Automotive Electronics
Automotive Infotainment
Automotive Powertrain/ECUs
Drones/Satellites
Gaming Systems
Hard Disk Drives
Notebooks/Tablets/Portable Devices
Routers
Smart Home Devices
Wireless infrastructure
Capabilities: Automated Packaging
Automated Pad Placement
Custom Automation
Custom Product Development
Modeling
Prototyping
Service
Testing
Typical Properties Color: Grey
Typical Properties Density (g/cc): 3.7
Typical Properties Operating Temperature Max (Celsius): 125
Typical Properties Operating Temperature Min (Celsius): -40
Typical Properties Outgassing CVCM (%): 0.15
Typical Properties Outgassing TML (%): 0.33
Typical Properties Shelf Life: 2 years from Date of Shipment
Thermal Properties Thermal Conductivity (W/mK): 10.2
Electrical Properties Volume Resistivity: 1 x 10^14
Compliance Lead Free: Yes
Compliance REACH: Yes
Compliance ROHS Compliant: Yes
Compliance UL Flammability Rating: V-0 pending
Typical Properties Reinforcement Carrier: none
Electrical Properties Dielectric Constant: 9
Mechanical Properties Hardness (Shore 00): 41
Dimensions Thickness Max (inches): 0.2
Dimensions Thickness Max (mm): 5
Dimensions Thickness Min (inches): 0.02
Dimensions Thickness Min (mm): 0.5
Thermal Properties Thermal Resistance @10 psi Max (C-in2/W): 0.643
Thermal Properties Thermal Resistance @10 psi Min (C-in2/W): 0.054
Thermal Properties Thermal Resistance @30 psi Max (C-in2/W): 0.043
Thermal Properties Thermal Resistance @30 psi Min (C-in2/W): 0.041
Thermal Properties Thermal Resistance @50 psi Max (C-in2/W): 0.042
Thermal Properties Thermal Resistance @50 psi Min (C-in2/W): 0.039
Dimensions Thickness Max (Microns): 5000
Dimensions Thickness Min (Microns): 500

Contact Form

Copyright © AIMRSE. All rights reserved.