Tflex UT20000
Brand: AIMRSE
Catalog Number
ATG-C8-022
Category
Gap Fillers
X
Description
| Product Overview: | Ultra-thin gap filler offering great thermal performance and handling. Tflex UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly. The elastomeric property of Tflex UT20000 provides excellent interfacing and wetting out mating surfaces in thin interface where efficiently transfer heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements. Tflex UT20000 is electrically non-conductive, stable from -40°C thru 200°C and offered in thicknesses that range from 0.008 inches (0.2mm) up to 0.040 inches (1.0mm). |
| Features and Benefits: | No fiberglass carrier to minimize thermal resistance, yet still easy to handle Excellent surface wetting for low contact resistance Unique formulation minimizes thermal resistance at low mounting forces Environmentally friendly solution that meets regulatory requirements including RoHS and REACH. |
| Industries: | Aerospace/Defense Automotive Consumer Industrial Telecom/Datacom |
| Applications: | Automotive ADAS Automotive Electronics Automotive Infotainment Automotive Powertrain/ECUs Drones/Satellites Gaming Systems Instrumentation Notebooks/Tablets/Portable Devices Routers Smart Home Devices Wireless infrastructure |
| Capabilities: | Automated Packaging Automated Pad Placement Custom Automation Custom Product Development Modeling Prototyping Service Testing |
| Typical Properties Color: | Grey |
| Typical Properties Density (g/cc): | 3.2 |
| Typical Properties Operating Temperature Max (Celsius): | 200 |
| Typical Properties Operating Temperature Min (Celsius): | -50 |
| Typical Properties Outgassing CVCM (%): | 0.09 |
| Typical Properties Outgassing TML (%): | 0.34 |
| Typical Properties Shelf Life: | 2 years from Date of Shipment |
| Thermal Properties Thermal Conductivity (W/mK): | 3 |
| Electrical Properties Volume Resistivity: | 2.20 x10^15 Ohm-cm |
| Compliance REACH: | Yes |
| Compliance ROHS Compliant: | Yes |
| Compliance UL Flammability Rating: | V-0 |
| Electrical Properties Dielectric Constant: | 5.9 |
| Mechanical Properties Hardness (Shore 00): | 56 |
| Dimensions Thickness Max (inches): | 0.04 |
| Dimensions Thickness Min (inches): | 0.008 |
| Thermal Properties Thermal Resistance @10 psi Max (C-in2/W): | 0.502 |
| Thermal Properties Thermal Resistance @10 psi Min (C-in2/W): | 0.172 |
| Thermal Properties Thermal Resistance @30 psi Max (C-in2/W): | 0.465 |
| Thermal Properties Thermal Resistance @30 psi Min (C-in2/W): | 0.132 |
| Thermal Properties Thermal Resistance @50 psi Max (C-in2/W): | 0.434 |
| Thermal Properties Thermal Resistance @50 psi Min (C-in2/W): | 0.124 |
| Dimensions Thickness Max (Microns): | 1000 |
| Dimensions Thickness Min (Microns): | 200 |
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