Ultra-High-Conductivity Gap Filler (34 W/mK)

Brand: AIMRSE

Catalog Number
ATG-C8-012
Category
Gap Fillers
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Description
Product Overview: Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties. 
Tflex™ HP34 Introduction 
Video
Features and Benefits: 34 W/mK bulk thermal conductivity
Silicone Free formulation
Maintains thermal performance under increased pressure
Low contact resistance with mating surfaces
Environmentally friendly solution that meets RoHS and REACH
Industries: 5G Data Infrastructure
5G Telecom
Aerospace/Defense
Automotive
Consumer Electronics
Data Infrastructure
Datacom
Servers
Applications: 5G Antenna Radome
Instrumentation/Test and measure
Notebooks/Tablets/Portable Devices
Routers
Servers
Smart Home Devices
Telecom cabinets
Wireless infrastructure
Capabilities: Automated Packaging
Automated Pad Placement
Custom Automation
Custom Product Development
Modeling
Prototyping
Service
Testing
Typical Properties Color: Grey
Typical Properties Density (g/cc): 2.3
Typical Properties Operating Temperature Max (Celsius): 125
Typical Properties Operating Temperature Min (Celsius): -40
Typical Properties Shelf Life: 1 years from Date of Shipment
Thermal Properties Thermal Conductivity (W/mK): 34
Electrical Properties Volume Resistivity: 10 Ω-cm
Compliance Lead Free: Yes
Compliance REACH: Yes
Compliance ROHS Compliant: Yes
Compliance UL Flammability Rating: V-0 (Pending)
Mechanical Properties Hardness (Shore 00): 50
Dimensions Thickness Max (inches): 0.2
Dimensions Thickness Max (mm): 4500
Dimensions Thickness Min (inches): 0.04
Dimensions Thickness Min (mm): 1
Thermal Properties Thermal Resistance @10 psi Max (C-in2/W): 0.212
Thermal Properties Thermal Resistance @10 psi Min (C-in2/W): 0.106
Thermal Properties Thermal Resistance @30 psi Max (C-in2/W): 0.185
Thermal Properties Thermal Resistance @30 psi Min (C-in2/W): 0.059
Thermal Properties Thermal Resistance @50 psi Max (C-in2/W): 0.11
Thermal Properties Thermal Resistance @50 psi Min (C-in2/W): 0.048
Dimensions Thickness Max (Microns): 5000
Dimensions Thickness Min (Microns): 0.2

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