Ultra-High-Conductivity Gap Filler (34 W/mK)
Brand: AIMRSE
Catalog Number
ATG-C8-012
Category
Gap Fillers
X
Description
| Product Overview: | Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties. Tflex™ HP34 Introduction Video |
| Features and Benefits: | 34 W/mK bulk thermal conductivity Silicone Free formulation Maintains thermal performance under increased pressure Low contact resistance with mating surfaces Environmentally friendly solution that meets RoHS and REACH |
| Industries: | 5G Data Infrastructure 5G Telecom Aerospace/Defense Automotive Consumer Electronics Data Infrastructure Datacom Servers |
| Applications: | 5G Antenna Radome Instrumentation/Test and measure Notebooks/Tablets/Portable Devices Routers Servers Smart Home Devices Telecom cabinets Wireless infrastructure |
| Capabilities: | Automated Packaging Automated Pad Placement Custom Automation Custom Product Development Modeling Prototyping Service Testing |
| Typical Properties Color: | Grey |
| Typical Properties Density (g/cc): | 2.3 |
| Typical Properties Operating Temperature Max (Celsius): | 125 |
| Typical Properties Operating Temperature Min (Celsius): | -40 |
| Typical Properties Shelf Life: | 1 years from Date of Shipment |
| Thermal Properties Thermal Conductivity (W/mK): | 34 |
| Electrical Properties Volume Resistivity: | 10 Ω-cm |
| Compliance Lead Free: | Yes |
| Compliance REACH: | Yes |
| Compliance ROHS Compliant: | Yes |
| Compliance UL Flammability Rating: | V-0 (Pending) |
| Mechanical Properties Hardness (Shore 00): | 50 |
| Dimensions Thickness Max (inches): | 0.2 |
| Dimensions Thickness Max (mm): | 4500 |
| Dimensions Thickness Min (inches): | 0.04 |
| Dimensions Thickness Min (mm): | 1 |
| Thermal Properties Thermal Resistance @10 psi Max (C-in2/W): | 0.212 |
| Thermal Properties Thermal Resistance @10 psi Min (C-in2/W): | 0.106 |
| Thermal Properties Thermal Resistance @30 psi Max (C-in2/W): | 0.185 |
| Thermal Properties Thermal Resistance @30 psi Min (C-in2/W): | 0.059 |
| Thermal Properties Thermal Resistance @50 psi Max (C-in2/W): | 0.11 |
| Thermal Properties Thermal Resistance @50 psi Min (C-in2/W): | 0.048 |
| Dimensions Thickness Max (Microns): | 5000 |
| Dimensions Thickness Min (Microns): | 0.2 |
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