FA Failure Analysis Probe Station
Catalog NO.: AIMRSE-PS-S-15
Structure mainly consists of a probe station system and a laser system. Performs failure analysis on chips and RF devices, IV/CV characterization of materials/devices, internal circuit/pad probing, and IC/panel internal circuit modification/layer removal at ambient or high-low temperatures.
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| Product Highlights | Failure analysis & laser test |
| Chuck Size | 4~12 inches (configurable) |
| Temperature Range | Ambient or high-low (optional) |
| Microscope / Optics | Uses 50X/100X objectives for laser processing |
| Positioning Precision | Min processing: 1μm (100X); Max processing: 40μm (50X) |
| Features | Integrated with laser system for failure analysis/circuit modification; ESI laser: 1064/532/355nm, 2.2mJ/pulse, 1-50Hz; quantel laser: 1064/532/355nm, 20/6/8mJ/pulse, 100Hz; Processes: Cu, Au, Poly Si, Al, SiO₂, Cr, ITO, Ni, TFT, RGB, Mo, Nitride, Polymide |
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