Probe Tips
| Cat | Products Name | Product Highlights | Price |
|---|---|---|---|
| AIMRSE-C-PT-1-ST | Standard Tungsten Needle | T-4 soft probe needle | Request a Quote |
| AIMRSE-C-PT-1-T4 | T-4 Series Soft Needle | BCP beryllium copper needle | Request a Quote |
| AIMRSE-C-PT-1-BCP | BCP Series Beryllium Copper Needle | WG gold-plated needle | Request a Quote |
| AIMRSE-C-PT-1-WG | WG Series Tungsten Needle | Low-noise coaxial probe | Request a Quote |
| AIMRSE-C-PT-2 | Low-Noise Coaxial Probe | GGB RF microwave probe | Request a Quote |
| AIMRSE-C-PT-3 | GGB RF Probe | ACP air coplanar probe | Request a Quote |
| AIMRSE-C-PT-4-ACP | ACP Air Coplanar Probe | Infinity 145GHz probe | Request a Quote |
| AIMRSE-C-PT-4-I | Infinity Probe | |Z| PCB high-flex probe | Request a Quote |
| AIMRSE-C-PT-4-PCB | |Z| Probe PCB | APT Kelvin 4-wire probe | Request a Quote |
| AIMRSE-C-PT-5 | APT Kelvin Probe | TITAN 26GHz RF probe | Request a Quote |
Overview
Tip Materials & Precision Manufacturing
Fig 1: AIMRSE probe tips in tungsten, beryllium copper, and gold‑plated configurations for diverse probing applications.
AIMRSE probe tips are precision‑ground and electropolished to achieve consistent tip geometry and surface finish. Tungsten tips offer exceptional hardness and sharpness, with tip radii down to 0.5 µm for probing advanced semiconductor nodes. Beryllium copper tips provide superior conductivity and ductility, making them ideal for high‑current applications and repeated touchdowns on hard pads. Gold‑plated tips minimize contact resistance and prevent oxidation on aluminum and copper bond pads. All tips are inspected under high magnification and shipped in protective packaging to ensure they arrive in pristine condition. Our probe tips are essential for wafer‑level device characterization, RF and mmWave probing, high‑power device testing, and failure analysis and debugging.
Available Probe Tip Configurations
Tungsten Probe Tips
Tip Radius 0.5 µm to 10 µm, High Hardness
Ideal for probing small geometry devices, advanced CMOS nodes, and applications requiring minimal pad damage. Long life on aluminum pads.
Beryllium Copper (BeCu) Tips
High Conductivity, Ductile, Tip Radius 5 µm to 50 µm
Preferred for high‑current and repetitive production testing. Softer material conforms to pad surface for low contact resistance.
Gold‑Plated Tips
Oxidation‑Resistant, Low Contact Resistance
Tungsten or BeCu cores with gold plating. Eliminates oxide formation on tips and pads. Essential for low‑voltage and low‑current measurements.
Specialty Probe Tips
Coaxial, High‑Voltage, and Custom Geometries
Tips for RF probing, high‑voltage breakdown testing, and custom applications. Bent shank, extended reach, and Kelvin configurations available.
Core Engineering Advantages
Consistent Tip Geometry
Every tip is precision‑ground to within ±0.5 µm of nominal radius. This ensures consistent contact area and pressure from tip to tip, eliminating a major source of measurement variability.
Electropolished Surface Finish
Tungsten tips receive an electropolish treatment that removes micro‑burrs and creates a smooth, uniform surface. This reduces contact resistance and prevents pad scratching during touchdown.
Universal Shank Compatibility
All AIMRSE probe tips feature standard 0.020″ (0.51 mm) or 0.050″ (1.27 mm) shank diameters, ensuring compatibility with AIMRSE probe holders and most industry‑standard positioners.
Probe Tip FAQ
Which probe tip material should I choose?
How do I select the correct tip radius?
How often should I replace my probe tips?
Can I clean and reuse contaminated tips?
Do you offer custom tip geometries?
Custom Probe Tip Services
Need a Specific Probe Tip Configuration?
From custom tip radii and bend angles to specialized plating and shank modifications, our team can supply probe tips tailored to your unique device geometry and measurement requirements.
Please specify material, tip radius, shank diameter, and any special geometry or plating requirements.
Note: All AIMRSE probe systems and components are designed exclusively for professional semiconductor R&D and industrial testing. Equipment must be operated by trained personnel in accordance with standard laboratory safety protocols.
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