Power Electronics (SiC/GaN)
The global transition toward electric vehicles (EVs), renewable energy infrastructure, and ultra-efficient industrial drives relies entirely on Wide Bandgap (WBG) semiconductors like Silicon Carbide (SiC) and Gallium Nitride (GaN). However, characterizing these devices pushes test equipment to extreme limits, often requiring breakdown voltages exceeding 10kV and pulsed currents surpassing 600A. AIMRSE High Power Probe Systems are engineered specifically to safely and accurately handle these immense electrical loads — and we understand that no two applications are alike. Our systems are fully customizable, from voltage/current ratings and arc-suppression methods to safety enclosures and thermal chuck ranges. We provide robust, arc-suppressed environments and heavy-duty contact mechanics that seamlessly interface with your existing high-power curve tracers and SMUs. By preventing catastrophic device failure during test and ensuring low-resistance contacts, we enable power device engineers to confidently measure Rdson, leakage, and breakdown characteristics without risking their wafers, their equipment, or their personnel.
Critical Testing Challenges in Power Electronics
Probing devices at kilovolt and multi-hundred-ampere levels introduces severe physical and electrical hazards. Standard probing setups are entirely insufficient and inherently dangerous for these applications.
High Voltage Arcing & Breakdown
Applying thousands of volts across microscopic tip‑to‑pad gaps can ionize ambient air, resulting in destructive arcing that destroys the DUT and melts probe tips. Conventional stations offer no protection against this phenomenon.
High Current Contact Resistance
Accurate milliohm‑range Rdson measurements require injecting hundreds of amps through a single‑needle probe — a recipe for overheating, contact welding, and erroneous data. Standard probes cannot distribute such high current loads.
Operator & Equipment Safety
Lethal voltages and explosive device failures are genuine risks during high‑power characterization. Open‑air probe stations offer zero protection, putting both personnel and expensive instrumentation in danger.
Key Power Electronics Applications
Our high-voltage probing solutions are trusted by leading automotive OEMs, foundries, and power module manufacturers globally.
Automotive EV Traction Inverters
Driving the electrification of the automotive industry. Characterize 1.2kV, 1.7kV, and 3.3kV SiC MOSFETs designed for 800V and 1000V EV battery architectures. Perform reliable tests at 200°C+ to validate device durability under severe under-hood thermal conditions.
Renewable Energy Infrastructure
Enabling hyper-efficient solar and wind power conversion. Test advanced IGBTs and SiC diodes utilized in grid-tied solar string inverters, requiring breakdown tests up to 10kV. Maintain fA-level noise floors to accurately measure off-state leakage currents.
Consumer Fast Charging (GaN)
Shrinking form factors while maximizing power density. Characterize lateral GaN devices used in USB-C PD fast chargers and data center power supplies. Support for double-pulse testing setups to evaluate gate charge (Qg) and switching losses directly on-wafer.
Aerospace & Defense Power
Ensuring absolute reliability for mission-critical systems. Perform Unclamped Inductive Switching (UIS) and short-circuit withstand time (SCWT) tests safely. Specialized high-power vacuum probe stations available to simulate high-altitude and space-bound power environments.
System Architecture Highlights
AIMRSE High Power platforms rely on advanced mechanical and electrical engineering to tame extreme energy safely at the wafer level. Every component is customizable — from voltage and current ratings to thermal management and safety interlocks — ensuring a perfect fit for your specific test requirements.
Why High-Power Architecture Matters
Running 10kV through a delicate micro-positioner is a recipe for disaster. We redesign the entire probing architecture from the ground up for maximum dielectric strength and current capacity, and we tailor it to your exact specifications.
Gold-Plated High-Voltage Chucks
For vertical power devices, the chuck itself must carry massive currents and withstand extreme voltages. Our specialized chucks feature ultra-flat, gold-plated surfaces for minimal contact resistance, combined with thick Teflon or ceramic isolation layers capable of standing off 10kV without leaking to the machine chassis. Available with optional temperature control (-60°C to +300°C) and custom chuck sizes for up to 300mm wafers.
Heavy-Duty Micro-Positioners
High-voltage cables are thick, heavy, and stiff. Standard micro-positioners will drift or buckle under their weight. AIMRSE equips high-power systems with oversized, direct-drive positioners featuring robust locking mechanisms. These maintain sub-micron stability even when routing thick triaxial or heavy gauge high-current cables to the DUT. Choose from manual or motorized versions, and optional probe card adapters for automated wafer probers.
Advanced Thermal Dissipation
Injecting hundreds of amps into a die generates immense localized heat. If not dissipated instantly, device characteristics shift, invalidating the data. We integrate rapid-response Thermal Chucks that sink heat quickly, while also allowing you to characterize devices at elevated temperatures (up to 300°C) to simulate real-world automotive engine bay environments. Customizable heating/cooling rates and chuck materials are available to match your specific test protocols.
Customer Success Stories
Our customizable high-power probing solutions have delivered measurable results for leading organizations worldwide.
Leading European Automotive Tier‑1
Challenge: Validate 1.7kV SiC MOSFETs for 800V EV traction inverters with high throughput and zero safety incidents.
Solution: Customized high-power system with pressurized nitrogen arc‑suppression, heavy‑duty positioners, and interlocked dark box.
Result: 40% reduction in characterization time, 100% safe operation over 5,000 test cycles, and first‑pass yield improvement of 5% through more accurate Rdson mapping.
US‑based WBG Foundry (8‑inch SiC)
Challenge: Perform automated 10kV breakdown voltage screening and Rdson uniformity mapping across 200mm wafers with minimal probe wear.
Solution: Fully automated probe system with high‑voltage thermal chuck, multi‑finger current probes, and custom software integration.
Result: Achieved 99.8% probe‑to‑pad alignment accuracy, 3x faster wafer‑level testing compared to previous manual methods, and eliminated arc‑related wafer scrap.
Japanese Power Module Manufacturer
Challenge: Perform double‑pulse switching characterization and short‑circuit ruggedness tests on 3.3kV SiC modules at 200°C.
Solution: Custom high‑temperature vacuum chuck with integrated Kelvin sensing and safety interlocks tied to a Keysight curve tracer.
Result: 60% reduction in fixture‑related measurement noise, enabling publication‑ready switching loss data; zero equipment damage after 500+ short‑circuit events.
European Research Institute (GaN HEMTs)
Challenge: Characterize lateral GaN devices for 100V‑650V fast charging applications with simultaneous low‑leakage (fA) and high‑current (100A) measurements.
Solution: Modular probe station with guarded high‑voltage chuck, low‑noise triaxial cabling, and optional liquid cooling for high‑power pulse testing.
Result: Achieved fA‑level off‑state leakage while pulsing up to 100A, enabling accurate modeling of dynamic Rdson; system now used as the reference testbed for three European Horizon projects.
Engagement Model
Our structured workflow ensures that your high-power testing facility is deployed with maximum capability and uncompromising safety. Because every application is unique, we begin by understanding your specific requirements and then tailor every aspect of the system accordingly.
Objective: Define the maximum voltage, current, and thermal envelopes for your WBG devices.
Services:
- Parameter Mapping: We evaluate your peak breakdown voltage (e.g., 3.3kV, 10kV) and pulsed current needs (e.g., 100A, 600A).
- Device Topology Review: Analyze whether your devices are vertical (requires active chuck bias) or lateral (e.g., GaN HEMTs), dictating chuck and probe selection.
- Customization Options: Discuss any special requirements such as multi‑site testing, automated wafer handling, or integration with existing software.
Objective: Configure a tailored system prioritizing operator safety and measurement accuracy.
Services:
- Arc Suppression Strategy: Select between pressurized gas chambers or Fluorinert liquid immersion chucks based on your voltage limits.
- Interlock Design: Engineer the safety enclosure (dark box) and hardware interlock routing to interface directly with your specific SMUs.
- Custom Accessories: Add thermal chucks, probe card adapters, or motorized positioners as needed.
Objective: Deliver, assemble, and connect the system to your high-power instrumentation.
Services:
- Robust Installation: Install the heavy-duty anti-vibration platform, shielded enclosure, and thermal chuck control systems.
- High-Voltage Cable Routing: Securely route and strain-relieve thick HV triaxial and high-current cables to prevent tension on the probes.
- Instrument Integration: Connect and synchronize with your existing curve tracers, SMUs, or custom control software.
Objective: Validate system integrity and train personnel on high-voltage protocols.
Services:
- Interlock Testing: Rigorously test all safety switches to ensure power is instantly cut when the enclosure is breached.
- Operator Training: Comprehensive training on safe probe landing techniques, liquid handling (if applicable), and avoiding accidental pad welding.
- Custom Test Scripts: Assist in developing automated test routines for your specific device types.
Objective: Maintain safety standards and precision throughout the system's operational life.
Services:
- Preventive Maintenance: Annual checks on isolation resistance, chuck planarity, and safety interlock functionality.
- Consumables Supply: Rapid delivery of high-current multi-finger probes, specialized HV cables, and dielectric fluids.
- Upgrade Paths: Easy system upgrades to higher voltages, larger wafer sizes, or advanced automation as your needs evolve.
Power Electronics Probing FAQ
What are the maximum voltage and current ratings of your systems?
How exactly do you prevent arcing at 10kV?
Are your high-power chucks capable of temperature sweeps?
How do you ensure operator safety during test?
Can I measure very low leakage currents (fA) on the same setup?
Don't Let Equipment Limitations Cap Your Voltages.
Whether you are validating 3.3kV SiC MOSFETs for traction inverters or high-speed GaN chargers, our team is ready to deliver a system that meets your extreme electrical requirements without compromising operator safety. Every system is custom‑built to your specifications — contact us to discuss your project.
Note: All AIMRSE probe systems and components are designed exclusively for professional semiconductor R&D and industrial testing. Equipment must be operated by trained personnel in accordance with standard laboratory safety protocols.
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