Optoelectronics & Photonics Testing

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Fiber optic probe aligned to a silicon photonic chip under a microscope.

The explosive growth of data centers, 3D sensing, and high-speed optical communications demands precision testing of optoelectronic devices like VCSELs, silicon photonics (PIC), and MicroLEDs. Characterizing these devices requires simultaneous optical and electrical probing with sub-micron alignment stability, absolute dark environments, and temperature control. AIMRSE Optoelectronics & Photonics Probe Systems are purpose-built to integrate fiber positioning stages, low‑noise electrical probes, and light‑tight enclosures into a single, thermally stable platform. Our systems enable you to perform LIV sweeps, spectral characterization, and high‑speed modulation tests directly on‑wafer — with the precision and repeatability demanded by R&D and production environments.

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Critical Testing Challenges in Optoelectronics

Optoelectronic devices present unique measurement hurdles that standard electrical probe stations cannot address. From sub‑micron fiber alignment to light isolation, we engineer solutions that overcome these obstacles.

Sub‑Micron Fiber & Probe Alignment

Coupling light into and out of waveguides or vertical‑cavity devices requires positioning accuracy below 0.1 µm. Manual positioners drift over time, causing irreproducible loss measurements. AIMRSE integrates motorized, piezo‑driven alignment stages with active feedback loops, ensuring stable optical throughput during temperature sweeps or prolonged test sequences.

Ambient Light Interference & Dark Environment

Photodetectors, VCSELs, and other optical devices are highly sensitive to stray light. Standard open‑air probe stations allow ambient illumination to corrupt low‑level optical power measurements. Our systems feature fully light‑tight enclosures with integrated electrical feedthroughs and optical windows, enabling absolute dark LIV characterization without background noise.

Thermal Stability for Optical Alignment

Optical coupling efficiency changes dramatically with temperature due to thermal expansion. Testing across temperature (‑40°C to 150°C) requires that the relative position between fiber and device remains within sub‑micron tolerance. Our thermally compensated probe systems incorporate low‑expansion materials and active temperature control to maintain alignment accuracy throughout the entire temperature range.

Key Optoelectronics Applications

From 3D sensing to high‑speed transceivers, our probing solutions accelerate time‑to‑market for the industry’s most demanding optical devices.

VCSEL array under test with integrated fiber probe.

VCSEL Arrays for 3D Sensing

Characterize vertical‑cavity surface‑emitting lasers (VCSELs) used in facial recognition, LiDAR, and consumer electronics. Perform LIV sweeps, near‑field/far‑field pattern measurements, and wafer‑level reliability tests with integrated fiber collection and dark‑box shielding.

Silicon photonic chip with edge coupler and fiber array.

Silicon Photonics (PIC) Testing

Enable high‑throughput testing of photonic integrated circuits (PICs) for data center transceivers and optical interconnects. Support for grating couplers and edge couplers via automated fiber arrays, combined with DC/RF electrical probing for integrated modulators and photodetectors.

MicroLED wafer with probe tips and light collection system.

MicroLED Display Testing

Accelerate the development of next‑generation displays. Test MicroLED arrays at the wafer level with simultaneous electrical excitation and optical power collection. Our systems support high‑density probe cards and fast photodetectors for high‑throughput production screening.

High‑speed photodiode with RF probe and fiber alignment.

High‑Speed Optical Receivers

Evaluate PIN and APD photodetectors for 100G/400G optical links. Combine ultra‑low‑noise electrical probes with RF‑capable fiber positioning to measure bandwidth, responsivity, and dark current without compromising signal integrity.

System Architecture & Core Advantages

AIMRSE Optoelectronics Probe Systems are engineered from the ground up to eliminate optical and electrical measurement errors, delivering the stability and flexibility required for cutting‑edge device research.

Designed for Simultaneous Optical & Electrical Characterization

By integrating precision fiber positioning, light‑tight shielding, and low‑noise electrical probes into a single platform, we empower you to extract full device parameters with unmatched confidence.

High‑Precision Fiber Positioning

We integrate motorized six‑axis stages with sub‑0.1 µm resolution and active alignment software. Whether coupling to grating couplers or edge couplers, our systems maintain stable optical throughput over hours of testing, with automated peak‑finding routines that reduce operator training time.

Light‑Tight & EMI‑Shielded Enclosure

Our dark boxes are constructed with double‑walled, anodized aluminum and light‑sealing gaskets, eliminating any ambient light penetration. Integrated electrical feedthroughs maintain signal integrity while the system remains completely light‑tight — essential for low‑level photocurrent and dark current measurements.

Thermal Management & Stability

Optical alignment is temperature‑sensitive. Our thermal chucks maintain ±0.1°C stability across a range of ‑60°C to +300°C, while low‑expansion materials minimize mechanical drift. Integrated temperature control ensures that your optical coupling efficiency remains constant, enabling accurate temperature‑dependent characterizations.

Customer Success Stories

Leading organizations rely on AIMRSE Optoelectronics Probe Systems to accelerate their photonic device development and production.

Global Leader in Silicon Photonics

Challenge: High‑throughput testing of 300mm wafers containing integrated modulators and germanium photodetectors required simultaneous DC/RF probing and fiber‑array coupling.
Solution: AIMRSE provided an automated system with 12‑fiber array alignment, motorized probe card, and light‑tight enclosure.
Result: 4× increase in throughput compared to manual alignment, ±0.1 dB coupling repeatability across temperature sweep, and zero contamination due to clean‑room compatible design.

Top‑tier VCSEL Manufacturer

Challenge: Wafer‑level LIV characterization of 10,000 VCSELs per wafer required fast optical power collection and dark‑room conditions.
Solution: Fully automated probe station with integrated integrating sphere and photodiode, housed in a light‑tight enclosure.
Result: Achieved 99.9% test yield with 50% reduction in test time; system now used for production release of automotive‑grade VCSELs.

European Research Institute – MicroLEDs

Challenge: Evaluating micro‑LED efficiency and lifetime at the single‑pixel level required high‑resolution optical collection and sub‑µs pulse driving.
Solution: Custom probe station with high‑speed pulse generators, photomultiplier tube (PMT) detection, and active temperature control.
Result: Enabled first‑ever direct measurement of micro‑LED external quantum efficiency at 10 µs pulse widths, leading to a Nature Electronics publication.

High‑Speed Optical Component Supplier

Challenge: Characterizing 56 Gbaud photodiodes required low‑loss RF probing and stable fiber alignment under temperature cycling.
Solution: AIMRSE delivered a system with 110 GHz electrical probes, thermally compensated fiber positioners, and integrated temperature chamber.
Result: Achieved ±0.2 dB fiber coupling stability over ‑40°C to +85°C, reducing characterization errors by 70% and speeding up qualification by 3 months.

Engagement Model

Our structured workflow ensures that your optoelectronics testing system is tailored to your specific devices and measurement requirements — from manual R&D stations to fully automated production solutions.

Objective: Understand your device types, test parameters, and throughput requirements.

Services:

  • Device‑Specific Analysis: We evaluate your device’s optical coupling method (grating/edge), electrical pad layout, and thermal requirements.
  • Throughput Modeling: Define whether manual, semi‑automated, or fully automated alignment is needed to meet your R&D or production goals.

Objective: Configure a custom system that balances precision, speed, and ease‑of‑use.

Services:

  • Fiber Alignment Strategy: Select from manual piezo stages, motorized linear stages, or active alignment with integrated cameras.
  • Light Management: Choose between integrating spheres, collimators, or fiber‑based collection; specify dark‑box or full‑enclosure shielding.
  • Electrical Interface: Integrate DC, RF, or high‑speed probes with your existing SMUs, VNAs, or custom drive electronics.

Objective: Deliver, assemble, and verify the system at your facility.

Services:

  • Factory Acceptance Testing (FAT): Complete system validation with your test devices prior to shipment.
  • On‑Site Installation: Professional setup, including vibration isolation, optical alignment verification, and calibration.
  • Operator Training: Hands‑on training for engineers and technicians on alignment routines, software control, and maintenance.

Objective: Ensure the system meets all performance specifications and integrates seamlessly into your workflow.

Services:

  • Performance Benchmarking: Quantify coupling efficiency, repeatability, and thermal drift against agreed KPIs.
  • Custom Software Development: Tailor our automation software to your test scripts, data formats, and production management systems.

Objective: Maintain peak performance and extend system capabilities as your needs evolve.

Services:

  • Preventive Maintenance: Annual inspections, cleaning, and recalibration to preserve alignment accuracy and electrical integrity.
  • Consumables & Upgrades: Fast delivery of fiber tips, probe needles, and retrofits for new device generations.

Optoelectronics Probing FAQ

What types of optical fibers and coupling methods do you support?
We support single‑mode and multimode fibers (SMF‑28, PM fibers, etc.) with both grating coupler and edge coupler alignment. Our systems include precision six‑axis stages and active alignment algorithms for both types, with optional fiber arrays for high‑density testing.
How do you ensure sub‑micron stability during temperature sweeps?
Our systems incorporate low‑coefficient‑of‑thermal‑expansion (CTE) materials in critical components, active temperature compensation, and thermal chucks with integrated cooling channels. This combination maintains optical alignment within ±0.2 µm over a ‑60°C to +300°C range.
Can I perform both DC and high‑speed RF measurements on the same setup?
Yes. We integrate RF probes up to 110 GHz alongside DC probes, all within the same light‑tight enclosure. Our system architecture ensures proper shielding and minimal crosstalk, allowing simultaneous electrical and optical characterization of high‑speed devices.
What options are available for automating fiber alignment?
We offer several levels: manual with piezo fine‑adjustment, motorized with software‑assisted peak finding, and fully automated with machine vision for probe‑to‑pad and fiber‑to‑device alignment. Our software also supports integration with your custom test scripts via Python, LabVIEW, or .NET.
Do you provide turnkey solutions that include instrumentation (SMUs, tunable lasers, etc.)?
Absolutely. We can supply a complete test ecosystem including source measure units, optical power meters, tunable lasers, and switching matrices — all integrated and pre‑calibrated. We also handle software integration to provide a single‑button measurement experience.

Accelerate Your Photonic Device Characterization.

Whether you are developing VCSEL arrays for 3D sensing, silicon photonics for data centers, or next‑generation MicroLED displays, our team is ready to deliver a custom probing solution that combines optical and electrical precision with unmatched stability.

Note: All AIMRSE probe systems and components are designed exclusively for professional semiconductor R&D and industrial testing. Equipment must be operated by trained personnel in accordance with standard laboratory safety protocols.

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