Precision Components
Enhancing Measurement Accuracy with Precision Engineering
A semiconductor probe station is only as capable as its individual components. While the mainframe provides the structural foundation, it is the precision components—the positioners, chucks, optics, and isolation systems—that determine the ultimate signal integrity and usability of the setup. Our Precision Components division focuses on the critical "last millimeter" of the test signal path, ensuring that mechanical stability and electrical isolation are maintained from the instrument interface down to the device pad.
Our portfolio includes sub-micron micro-positioners engineered for zero backlash, thermal chucks capable of maintaining temperature uniformity within ±0.1°C across a 300mm wafer, and high-resolution optical systems designed specifically for the long working distances required in probing. Furthermore, we address environmental noise through advanced EMI shielding enclosures and active vibration isolation tables. These components are designed not only for our own probe systems but are also available as upgrades or OEM integrations for existing test setups, enabling researchers to extend the lifespan and capability of their current equipment.
We utilize high-grade materials such as gold-plated copper for thermal transfer, invar for thermal stability, and aircraft-grade aluminum for structural rigidity. Whether you are performing ultra-low current measurements requiring triaxial guarding or high-frequency characterization demanding absolute mechanical rigidity, our components provide the performance margin necessary for next-generation device testing.
Component Selection Matrix
| Component Category | Key Specification | Material / Type | Primary Benefit | Target Application |
|---|---|---|---|---|
| Micro-Positioners | 0.7μm to 10μm Resolution | Magnetic / Vacuum Base | Backlash-free movement | Pad alignment, RF probing, Failure analysis |
| Thermal Chucks | -60°C to +300°C | Gold-Plated / Triaxial | Uniform heating/cooling | Reliability testing, TDDB, NBTI, Hot/Cold soak |
| Microscope Systems | 10x to 2000x Zoom | Stereo / Metallographic | Long Working Distance | Visual inspection, Laser cutting, alignment |
| Shielding Box | >80dB Attenuation | Aluminum / Steel | EMI/RFI / Light isolation | Low current (fA) testing, Photosensitive devices |
| Vibration Table | < 2.5Hz Resonance | Active / Passive Air | Mechanical dampening | Sub-micron probing, MEMS, Interferometry |
Engineering Guide: Optimizing Your Setup
Mechanical & Optical Selection:
- Positioner Resolution: For standard pads (100μm), a 100 TPI screw is sufficient. For small pads (<50μm) or internal circuit nodes, utilize differential micrometers offering sub-micron precision.
- Base Type: Magnetic bases offer quick repositioning on steel platens. Vacuum bases are required for non-magnetic platforms (like copper or granite) and offer superior stability for RF probing.
- Optical Resolution: Stereo microscopes provide 3D depth perception perfect for landing probes. Metallographic (compound) microscopes provide higher resolution for inspecting trace defects but have a shallower depth of field.
- Working Distance: Ensure the microscope objective has a Long Working Distance (LWD) of at least 20mm to prevent collision with probe arms and needles.
Electrical & Thermal Selection:
- Chuck Plating: Gold plating is standard for low contact resistance. Nickel plating is preferred for high-temperature durability (>200°C) as gold may diffuse.
- Triaxial Guarding: For currents below 100pA, the chuck must use a triaxial connector where the guard layer is driven at the same potential as the signal to eliminate leakage capacitance.
- Shielding: A "Dark Box" is mandatory for light-sensitive devices and for blocking 60Hz/50Hz mains hum in low-level measurements.
- Active vs. Passive Isolation: Passive air tables are sufficient for most general probing. Active isolation is required for sub-micron movements in high-traffic buildings to cancel out low-frequency floor vibrations.
Precision Component Categories
Micro-Positioners
Our Micro-Positioners are engineered for precise, rectilinear motion in X, Y, and Z axes. Utilizing high-quality cross-roller bearings and precision-ground lead screws, they eliminate mechanical backlash and drift. Options range from standard 100 TPI models for general pad probing to differential micrometer models offering sub-micron resolution for examining internal circuit nodes.
Available with switchable magnetic bases for steel platens or vacuum bases for granite/copper platens. Specialized RF positioners feature increased rigidity and specific mounting interfaces for calibration substrates, ensuring stable contact during frequency sweeps.
View Positioners
Thermal Chucks
The heart of environmental testing, our Thermal Chucks provide rapid heating and cooling with exceptional temperature uniformity across the wafer. Ranging from -60°C to +300°C, these systems are controlled via high-precision PID controllers. The chuck surface utilizes a unique multi-zone heater design to compensate for edge heat loss.
For low-current applications, our Triaxial Thermal Chucks feature an isolated guard layer driven at signal potential, reducing leakage currents to the femtoampere level even at elevated temperatures. Surface options include Gold plating for low contact resistance or Nickel for durability.
View Thermal Chucks
Microscope Systems
Visualization is key to accurate probing. We offer a range of optical solutions tailored for the probe station environment. Our Stereo Zoom Microscopes provide excellent depth of field and a wide field of view, making them ideal for landing probes on standard pads. For smaller geometries, our Metallographic Systems offer magnifications up to 2000x.
Crucially, all our objectives feature Long Working Distances (LWD) to provide ample clearance for probe arms and needles. Integrated LED coaxial and ring lighting ensures optimal contrast on reflective wafer surfaces. Camera ports allow for integration with CCD/CMOS sensors for video capture and screen-based navigation.
View Optics
Probe Holders & Arms
The probe holder is the critical link between the cable and the needle. We manufacture high-performance holders designed to maintain signal integrity and ease of use. Coaxial Holders are suitable for general-purpose DC and AC testing. Triaxial Holders feature a guarded design essential for measuring currents below 100pA, effectively eliminating cable leakage.
We also offer High Voltage/Current Arms utilizing PEEK insulation for safety up to 10kV, and RF Probe Arms designed with rigid mechanics for stable GSG probe planarization. All holders are compatible with our standard micro-positioners.
View Probe Holders
Anti-Vibration Platforms
To measure the limits of device performance, the test environment must be noise-free. Our Shielding Dark Boxes provide a Faraday cage effect, attenuating external electromagnetic interference (EMI) and radio frequency interference (RFI) by over 80dB, while simultaneously blocking ambient light for photosensitive devices.
For mechanical stability, our Vibration Isolation Tables utilize pneumatic air springs to decouple the probe station from building vibrations. This active or passive damping is critical for sub-micron probing and laser applications, preventing probe tip damage and ensuring stable electrical contact.
View ShieldingEnhancing Applications
Low-Current Characterization
Achieving fA-level resolution requires triaxial chucks and dark box shielding to eliminate leakage and noise.
RF / mmWave Testing
Requires high-stability micro-positioners and vibration isolation to maintain calibration during frequency sweeps.
Failure Analysis
High-magnification microscopes and laser cutters allow for precise isolation of defects and internal node probing.
Reliability Testing
Thermal chucks enable long-duration stress tests (HCI, NBTI) at elevated temperatures with high stability.
Integration Support
Ensuring these components work seamlessly with your existing setup is our priority. We provide:
- Retrofit Kits: Mounting adapters for third-party probe stations.
- Custom Mounting: Engineering services for non-standard samples or PCBs.
- Optical Calibration: On-site alignment and cleaning of optical systems.
Note: All AIMRSE probe systems and components are designed exclusively for professional semiconductor R&D and industrial testing. Equipment must be operated by trained personnel in accordance with standard laboratory safety protocols.
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