Wafer-Level Chip Scale Package Probe Head
Catalog NO.: AIMRSE-C-TC-4
Probe head used for testing Wafer Level Chip Scale Packages (WLCSP). It serves as the critical interface connecting the WLCSP device to Automatic Test Equipment (ATE) for functional testing and parameter measurement during the wafer-level manufacturing process.
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| Product Highlights | WLCSP Probe Head |
| Current Rating | 0.5-3 |
| Pitch (mm) | ≥0.13 |
| Package Types Supported | WLCSP |
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